Loomis designs and manufactures precision scribe dicing machines employing patented technologies to handle the unique needs of our clients. These machines are ideal for cleaving and dicing laser diodes, optical detectors, MMICs, transistors, light emitting diodes, and more.
Consistent yields with clean, efficient and debris-free die starts with our proprietary precision scribe tool. The toolholder is designed for accurate scribing at the optimum angle, force and speed. Controlled-strain cleaving is custom configured.
We work with you to develop processes that meet your application’s unique needs.