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Breaking: Limited Contact Dicing

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Related Topics

Machines

LSD-155

LSD-100

Technology

Break Wheel

What is limited contact dicing? "Limited contact" dicing refers to a scribe and break process where the breaking mechanism applies a force over a limited area of the wafer.

Why use limited contact dicing? When materials are sensitive to contact pressure, it is necessary to employ limited contact dicing rather than full contact dicing. MMIC's, for example, may contain airbridges that can collapse under normal breaking pressures. The LSD-100 and LSD-150 Dicing Machines offer breaking mechanisms that can effectively avoid sensitive areas of the wafer.

Process: Limited contact dicing is achieved by making a scribe line along the separation channels of a wafer and then applying a bending force across the scribe line. The scribe line creates a stress concentration that drives crack propagation down through the wafer. If the scribe line is created properly, the crack will propagate along the scribe line.

Applications: Micro-electromechanical systems (MEM's), MMIC's with Airbridges, vertical lasers (viscels)

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