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LSD-155
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LSD-155: Features & Specifications

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Scribing

Cleaving

LSD-155 Brochure

LSD-155

Automation

  • Automatically process large "grids" of laser bars for dicing, cleaving high quality mirror facets and dicing wafters
  • Utilizes advances automation features that allow the high resolution vision system to process your material with micron level accuracy
  • Features a tuned, low-inertia scribing module that enables fast peck* speeds while maintaining optimal peck quality
  • Multiple cleaving options allow the LSD-155 to be configured to optimize cleave, quality, & speed

Features

  • Loomis diamond tool-holder with precise force, positioning, ultra-low inertia and high speed operation capability that produces unparalleled scribe quality
  • Limited-contact cleaving options
  • Ring pair, saw frame and Loomis square frame compatibility
  • Smooth, accurate, air-bearing control in X and Y axis
  • Fully automated alignment and processing
  • High-resolution digital camera with autofocus and interchangeable Mitutoyo Objective Lenses
  • Advanced machine vision algorithms for pattern recognition, channel and angle alignment
  • Modular construction and design that minimizes and simplifies maintenance
  • Password protected access for operator, technician and maintenance level personnel
  • Full 360 Degree hands-off material rotation for processing material on multiple axis

High speed placement of short scribe lines (video)
Specifications

LSD
Dimensions (h,w,d) (28.0, 39.0, 27.0) in (71.1, 99.0, 68.6) cm
Weight 147.0 lbs 68.2 kg

Computer (specifications may vary)
Dimensions (h,w,d) (16.5, 7.5, 17.0) in (41.9, 19.1, 43.2,) cm
Weight 30.1 lbs 13.7 kg

Monitor 1440 X 900 resolution (specifications may vary)
Dimensions (h,w,d) (12, 17.5, 2.5) in (30.5, 44.5, 6.5) cm
Weight 8 lbs 3.6 kg

Electrical Specifications
Power Requirements 150W, 100-277 VAC, 50-60 HZ  

Pneumatic Specifications
Pressure Requirements 75 psi 517 kPa

Miscellaneous Specifications
Optical Magnification Mitutoyo 5X objective standard (1300┬Ám field of view)
10X and 20X objective lenses are available options
Positioning Accuracy 1 micron utilizing pattern recognition
Certifications CE and Semi S2 Approved

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