What is full contact dicing? "Full contact" dicing refers to a scribe and break process where the breaking mechanism applies a force over a distributed area of the wafer.
Why use full contact dicing? When materials are not sensitive to contact pressure, it is often beneficial to employ full contact dicing rather than limited contact dicing.
Process: Full contact dicing is achieved by making a scribe line along the separation channels of a wafer and then applying a bending force across the scribe line. The scribe line creates a stress concentration that drives crack propagation down through the wafer. If the scribe line is created properly, the crack will propagate along the scribe line.
