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The Loomis LSD-110 break mechanism is more subtle and faster than the LSD-100. It is very productive, yielding dice with industry-leading reliability. It can dice three to four 100 mm wafers per hour (assuming a nominal die size of 1x1 mm).
The scribe line guides the break. It is a single crack across the wafer that causes the wafer to break into strips, or the strip to break into dice.
The LSD-110, like the LSD-100, uses beam bending to induce tensile strain lateral to the scribe line.
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