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The LSD-100 is ideal for the following processes:
Full Contact Dicing
Applying breaking pressure to a scribed wafer over the surface of the wafer. For use with Detectors, optical filters, light emitting diodes, and lasers.
Limited Contact Dicing
Applying breaking pressure to a scribed wafer by a limited set of contact points thereby preserving the integrity of the components. For use with Micro-electromechanical systems (MEM's), MMIC's with Airbridges, and vertical lasers (viscels).
High Throughput Bar Dicing
A "batch processing" approach to dicing laser bars using customized break wheel technology.
Separating a material along its natural crystal planes to create laser bars, modulators, wave guides, and perform failure analysis.