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LSD-100: Processes

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Scribing

Cleaving

LSD-100 Machine Breaking Process

The LSD-100 is ideal for the following processes:

Full Contact Dicing
Applying breaking pressure to a scribed wafer over the surface of the wafer. For use with Detectors, optical filters, light emitting diodes, and lasers.
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Limited Contact Dicing
Applying breaking pressure to a scribed wafer by a limited set of contact points thereby preserving the integrity of the components. For use with Micro-electromechanical systems (MEM's), MMIC's with Airbridges, and vertical lasers (viscels).
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High Throughput Bar Dicing
A "batch processing" approach to dicing laser bars using customized break wheel technology.
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Cleaving
Separating a material along its natural crystal planes to create laser bars, modulators, wave guides, and perform failure analysis.
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